C52100
C52100
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| C5210 | – | CuSn8 | C52100 | / |
Merit
It has excellent electrical conductivity, fatigue resistance, good brazing and welding performance, and is not easily quenched at high (low) temperatures.
Applications
Electronic connectors, mobile phone components.
JIS: C5210
DIN: –
EN: CuSn8
UNS: C52100
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| Cu | Remainder |
| Sn | 8 |
| Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) | Bending Test(90°)GW | Bending Test(90°)BW |
| R370 | 370-450 | 300max | 50min | 90-120 | 0 | 0 |
| R450 | 450-550 | 370min | 20min | 135-175 | 0 | 0 |
| R540 | 540-630 | 470min | 13min | 170-200 | 0 | 0 |
| R600 | 600-690 | 540min | 5min | 190-220 | 0 | 0 |
| R660 | 660-750 | 620min | 3min | 210-240 | 0 | 0 |
| R740 | 740min | 700min | – | 230min | 0 | 0 |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.
| Density (g/cm³) | 8.80 |
| Electrical conductivility IACS%(20℃)* | 13 |
| Modulus of elasticity (KN/mm²) | 115 |
| Coefficient of thermal expansion 10-6/K | 18.5 |
| Thermal conductivity W/(m*K) | 67 |
*value for the lowest temper class