C18665
C18665
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| MSP1 | CuMg | CuMgP | C18665 | / |
Merit
C18665 is a high Magnesium (Mg) alloyed material with excellent formability at medium strength and good conductivity.Excellent stress relaxation resistance.Excellent stress corrosion cracking resistance.Excellent fatigue properties.
Applications
Typical applications are automotive, electrical and electronic connectors,relays, current carrying springs and junction boxes.
| Cu | min. 99 |
| Mg | 0.4-0.9 |
| P | 0.002-0.04 |
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| Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) | Bending Test(90°)GW | Bending Test(90°)BW |
| 1/4H | 360-450 | min. 330 | min. 14 | 90-140 | – | – |
| 1/2H | 420-510 | min. 370 | min. 10 | 120-170 | 0 | 0 |
| H | 480-570 | min. 400 | min. 7 | 150-190 | 0 | 0.5 |
| EH | 540-630 | min. 490 | min. 5 | 170-210 | 0.5 | 1.5 |
| SH | min. 590 | min. 540 | – | min.180 | – | – |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.
| Density (g/cm³) | 8.81 |
| Electrical conductivility IACS%(20℃)* | 62 |
| Modulus of elasticity (KN/mm²) | 125 |
| Coefficient of thermal expansion 10-6/K | 17.3 |
| Thermal conductivity W/(m*K) | 264 |
*value for the lowest temper class
JIS: MSP1
DIN: CuMg
EN: CuMgP
UNS: C18665
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