BR-1(5J20110)

Standard

JIS DIN EN ASTM/UNS/CDA GB/T
TM1.200R110 TB20110 TM2 5J20110

Merit

Thermal bimetal is a composite material that is firmly bonded by two or more layers of alloys with different linear expansion coefficients. The alloy layer with a larger expansion coefficient is called the active layer, and the alloy layer with a smaller expansion coefficient is called the passive layer. An intermediate layer can be added between the active layer and the passive layer to adjust the resistance. When the ambient temperature changes,Due to the different expansion coefficients of the active layer and the passive layer, bending or rotation occurs.

 

Applications

It is mainly used for automatic control devices such as temperature control, action and temperature compensation, current limitation, temperature indication, etc., and heat-sensitive elements in instruments and meters.

copper strip
JIS: TM1.200R110
DIN: TB20110
EN: –
UNS: TM2
Grade Chemistry
High Expansion Alloy (53%) Alloy P Mn:72%; Cu:18%; Ni:10%
Low Expansion Alloy (47%) Alloy 10 Ni:36%; Fe:Bal
Flexivity(Specific Curvature) 39.0±4% x 10-6 (mm/mm)/°C
Max. Sensitivity Temperature Range -20 to 200
Useful Deflection Temperature Range -70 to 250
Max. Recommended Temperature 350
Electrical Resistivity at 25℃ 1.12 μ Ω.m

Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.

Density (g/cm³) 7.76
Modulus of elasticity (KN/mm²) 140

*value for the lowest temper class

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