C19900 (Fine Grain Titanium Copper Foil)

Standard

JIS	DIN	EN	ASTM/UNS/CDA	GB/T
/	/	/	C19900	/

Merit

High strength, high elasticity, high stress relaxation characteristics and high fatigue resistance, high precision thickness, high reliability, ideal substitute material for high beryllium copper.

Applications

mobile phone auto focus, camera module spring materials.

Cu+Ti	min. 99.5
Ti	2.4-3.5

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Temper	Tensile Strength（Mpa）	Yield Strength（Mpa）	Elongation（%）	Hardness（Hv）	Thickness（mm）	Bending Test(90°)GW	Bending Test(90°)BW
XSH	1050-1400	–	–	310-380	0.03-0.08	–	–
GSH	1300-1600	–	–	350-450	0.03-0.08	–	–

Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.

Density (g/cm³)	8.7
Electrical conductivility IACS%(20℃)*	10
Modulus of elasticity (KN/mm²)	127
Coefficient of thermal expansion 10-6/K	17.6
Thermal conductivity W/(m*K)	49

*value for the lowest temper class

UNS: C19900

C19900 (Fine Grain Titanium Copper Foil)