C12200
C12200
Standard
JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
C1220 | SF-Cu 2.0090 | Cu-DHP / CW024A | C12200 | / |
Merit
Cu-DHP is a phosphorus-deoxidized copper with a limited, high amount of residual Phosphorus. Another advantage includes zero risk to hydrogen embrittlement when heated for brazing, welding, soldering or annealing. It can be deformed excellent,either hot or cold.
Applications
Cu-DHP is primarily used in pipe caps, brazed heat exchangers and other applications that require high temperature joining or severe forming. It can also be used in many electrical applications such as heating elements and wire connectors.
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Cu | min. 99.9 |
P | 0.015-0.04 |
Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) | Bending Test(90°)GW | Bending Test(90°)BW |
R220 | 220-260 | max. 140 | min. 33 | 40-65 | 0 | 0 |
R240 | 240-300 | min. 180 | min. 8 | 65-95 | 0 | 0 |
R290 | 290-360 | min. 250 | min. 4 | 90-110 | 0 | 0 |
R360 | min. 360 | min. 320 | min. 2 | min. 110 | 0 | 0.5 |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.
Density (g/cm³) | 8.9 |
Electrical conductivility IACS%(20℃)* | 79 |
Modulus of elasticity (KN/mm²) | 132 |
Coefficient of thermal expansion 10-6/K | 17.6 |
Thermal conductivity W/(m*K) | 330 |
*value for the lowest temper class