C18080
C18080
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| / | CuCrAgFeTiSi | CuCrAgFeTiSi | C18080 | / |
Merit
C18080 has very high electrical and thermal conductivity. Excellent formability and high resistance to stress relaxation make it the material of choice for high pressure and high temperature connectors.
Applications
Applied to high current (above 5A) electronic components, semiconductor components, connectors,relay springs.
| Cu | Remainder |
| Cr | 0.2-0.7 |
| Ti | 0.01-0.15 |
| Fe | 0.02-0.2 |
| Si | 0.01-0.1 |
| Ag | 0.01-0.3 |
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| Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) |
| R480 | 450-560 | min. 450 | min. 7 | 140-170 |
| R540 | 540-630 | min. 520 | min. 2 | 150-180 |
| TR08 | 520-620 | min. 500 | min. 7 | 160-190 |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.
| Density (g/cm³) | 8.92 |
| Electrical conductivility IACS%(20℃)* | 79 |
| Modulus of elasticity (KN/mm²) | 140 |
| Coefficient of thermal expansion 10-6/K | 17.6 |
| Thermal conductivity W/(m*K) | 320 |
*value for the lowest temper class
DIN: CuCrAgFeTiSi
EN: CuCrAgFeTiSi
UNS: C18080
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