C19900

Standard

JIS DIN EN ASTM/UNS/CDA GB/T
/ / / C19900 /

Merit

High strength, high elasticity, high stress relaxation characteristics and high fatigue resistance, high precision thickness, high reliability, ideal substitute material for high beryllium copper.

 

Applications

Applied to products with ultra-high lifespan and contact force (such as Jack, Clip, Battery Conn, Ground Conns, Anntana, CPU cocket, etc.).

Cu+Ti min. 99.5
Ti 2.4-3.5

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Temper Tensile Strength(Mpa) Yield Strength(Mpa) Elongation (%) Hardness(HV) Thickness(mm) Bending Test(90°)GW Bending Test(90°)BW
H 920-1080 850-1000
(min. 830)*1
min. 10 300-340 t≤0.15 0 0.5
0.15<t<0.25 0.5 1
EH 970-1100 890-1050
(min. 880)*2
min. 6 310-360 t≤0.12 0 1
0.12<t<0.22 1 2
SH 1010-1200 950-1150 min. 5 315-380 t≤0.08 0 1
0.08<t≤0.1 1 2
0.10<t<0.15 1 3
ESH 1050-1250 1000-1200 min. 3 320-400 t<0.08 0.5 4
0.08≤t≤0.15 1 6

1*thickness: min. 0.25mm; 2*thickness: min. 0.22mm

Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.

Density (g/cm³) 8.7
Electrical conductivility IACS%(20℃)* 13
Modulus of elasticity (KN/mm²) 127
Coefficient of thermal expansion 10-6/K 17.6
Thermal conductivity W/(m*K) 49

*value for the lowest temper class

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UNS: C19900
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