C19900
C19900
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| / | / | / | C19900 | / |
Merit
High strength, high elasticity, high stress relaxation characteristics and high fatigue resistance, high precision thickness, high reliability, ideal substitute material for high beryllium copper.
Applications
Applied to products with ultra-high lifespan and contact force (such as Jack, Clip, Battery Conn, Ground Conns, Anntana, CPU cocket, etc.).
JIS: /
DIN: /
EN: /
UNS: C19900
- Sophia
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- sophia@kinmachi.com
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| Cu+Ti | min. 99.5 |
| Ti | 2.4-3.5 |
| Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) | Thickness（mm） | Bending Test(90°)GW | Bending Test(90°)BW |
| H | 920-1080 | 850-1000 (min. 830)*1 |
min. 10 | 300-340 | t≤0.15 | 0 | 0.5 |
| 0.15＜t＜0.25 | 0.5 | 1 | |||||
| EH | 970-1100 | 890-1050 (min. 880)*2 |
min. 6 | 310-360 | t≤0.12 | 0 | 1 |
| 0.12＜t＜0.22 | 1 | 2 | |||||
| SH | 1010-1200 | 950-1150 | min. 5 | 315-380 | t≤0.08 | 0 | 1 |
| 0.08＜t≤0.1 | 1 | 2 | |||||
| 0.10＜t＜0.15 | 1 | 3 | |||||
| ESH | 1050-1250 | 1000-1200 | min. 3 | 320-400 | t＜0.08 | 0.5 | 4 |
| 0.08≤t≤0.15 | 1 | 6 |
1*thickness: min. 0.25mm; 2*thickness: min. 0.22mm
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.
| Density (g/cm³) | 8.7 |
| Electrical conductivility IACS%(20℃)* | 13 |
| Modulus of elasticity (KN/mm²) | 127 |
| Coefficient of thermal expansion 10-6/K | 17.6 |
| Thermal conductivity W/(m*K) | 49 |
*value for the lowest temper class