C70250 WIRE

Standard

JIS DIN EN ASTM/UNS/CDA GB/T
C7025 CuNi3SiMg CuNi3SiMg C70250 /

Merit

Good corrosion resistance in nature atmosphere and industrial atmosphere. It is good at stress corrosion cracking.

 

Applications

Components for electrical industry connectors Relay springs Springs Semiconductor components

Cu min. 96.2
Ni 2.2-4.2
Si 0.25-1.2
Mg 0.05-0.3

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Temper Diameter(mm) Tensile Strength(MPa) min Tensile Strength(MPa) max Hardness(HV) Bending Test(90°)GW Bending Test(90°)BW
1/2H 0.4-1.6 450 610
H 0.4-1.0 685 805

Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.

Density (g/cm³) 8.82
Electrical conductivility IACS%(20℃)* 40
Modulus of elasticity (KN/mm²) 127
Coefficient of thermal expansion 10-6/K 17.7
Thermal conductivity W/(m*K) 190

*value for the lowest temper class

微信图片_20241127094622(1)
JIS: C7025
DIN: CuNi3SiMg
EN: CuNi3SiMg
UNS: C70250
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