C72700 ROD

Standard

JIS DIN EN ASTM/UNS/CDA GB/T
/ / CuNi9Sn6 C72700 /

Merit

With electrical and thermal conductivity considerably greater than other high-strength copper alloys. This alloy features high fatigue strength and resistance to wear, corrosion, galling, and stress relaxation.

 

Applications

Industrial electrical connectors, relays, stamped terminals, semiconductor lead frames.

Cu  Remainder
Ni 8.5-9.5
Sn 5.5-6.5

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Temper Tensile Strength(Mpa) Yield Strength(Mpa) Elongation (%) Hardness(HV)
TB00 420-500 min. 200 min. 30 90-125
TD01 460-560 min. 300 min. 15 140-180
TD02 540-640 min. 400 min. 10 160-200
TD03 620-720 min. 550 min. 3 200-240
TD04 700-820 min. 600 ≈1 220-260
TDX min. 780 min. 650 ≈1 max. 320
TF 740-860 min. 510 min. 10 230-270
TH1 850-950 min. 650 min. 8 270-310
TH2 880-980 min. 720 min. 8 290-320
TH3 950-1050 min. 800 min. 4 310-340
TH4 1000-1100 min. 900 ≈3 320-360
THX min. 1050 min. 950 ≈1 max. 390

Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.

Density (g/cm³) 8.9
Electrical conductivility IACS%(20℃)* 9
Modulus of elasticity (KN/mm²) 120
Coefficient of thermal expansion 10-6/K 17.25
Thermal conductivity W/(m*K) 53.6

*value for the lowest temper class

微信图片_20241126173800(1)
EN: CuNi9Sn6
UNS: C72700
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