C75200
C75200
Standard
JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
C7521 | / | CuNi18Zn20 | C75200 | / |
Merit
Has good yield strength and fatigue strength, good elasticity, excellent formability and bending performance, good ductility, durability, and corrosion resistance
Applications
Industrial electrical connectors, relays, stamped terminals, semiconductor lead frames
Cu | 62 |
Ni | 18 |
Zn | Remainder |
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Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) | Bending Test(90°)GW | Bending Test(90°)BW |
R380 | 380-450 | 250max | 27min | 85-115 | 0 | 0 |
R450 | 450-520 | 250min | 9min | 115-160 | 0 | 0 |
R500 | 500-590 | 410min | 3min | 160-190 | 0 | 0 |
R580 | 580-670 | 510min | – | 180-210 | 0.5 | 0 |
R640 | 640-730 | 600min | – | 200-230 | 3.5 | 2 |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.
Density (g/cm³) | 8.7 |
Electrical conductivility IACS%(20℃)* | 6 |
Modulus of elasticity (KN/mm²) | 135 |
Coefficient of thermal expansion 10-6/K | 17.7 |
Thermal conductivity W/(m*K) | 32 |
*value for the lowest temper class
JIS: C7521
EN: CuNi18Zn20
UNS: C75200
- Sophia
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